Funder
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference40 articles.
1. H. Qiu, X. Hu, X. Jiang et al., The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration. Mater. Lett. 256, 126609 (2019)
2. A. Sharma, Y. Jang, J. Kim, J. Jung, Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications. J. Alloys Compd. 704, 795–803 (2017)
3. M. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54, 1741–1768 (2019)
4. A. Sharma, B.G. Baek, J.P. Jung, Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn-Ag-Cu alloy. Mater Des. 87, 370–379 (2015)
5. N.S.M. Zaimi, M.A.A.M. Salleh, M.M.A.B. Abdullah et al., Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder. Series: Mater. Sci. Eng. 701, 012033 (2019)
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献