Effect of isothermal ageing process on microstructural changes in Bi-Ag lead-free solder alloys-Reference-Cited by-同舟云学术

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Effect of isothermal ageing process on microstructural changes in Bi-Ag lead-free solder alloys

Published:2020-07-26 Issue: Volume: Page:1-8
ISSN:2374-068X
Container-title:Advances in Materials and Processing Technologies
language:en
Short-container-title:Advances in Materials and Processing Technologies

Author:

Azmah Hanim M.A.¹²,Ghamarian Nima¹,Nahavandi M.¹,Zainal Zulkarnain³⁴,Hong Ngee Lim⁴

Affiliation:

1. Department of Mechanical and Manufacturing Engineering, Universiti Putra Malaysia , Serdang, Selangor, Malaysia

2. Research Center Advance Engineering Materials and Composites (AEMC), Universiti Putra Malaysia , Serdang, Selangor, Malaysia

3. Institute of Advance Technology, Universiti Putra Malaysia , Serdang, Selangor, Malaysia

4. Department of Chemistry, Universiti Putra Malaysia , Serdang, Selangor, Malaysia

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/2374068X.2020.1797295

Reference17 articles.

1. Microstructural Evaluation of Bi-Ag and Bi-Sb Lead-Free High-Temperature Solder Candidates on Copper Substrate with Multiple Reflow Number

2. Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications

3. Faceting Behavior of Primary Ag in Bi-Ag Alloys for High Temperature Soldering Applications

4. Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi–Zn solder alloys

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications;Soldering & Surface Mount Technology;2024-02-09

2. Analysis of extensive wetting angle vs. cooling rate data in Bi-, Zn- and Sn-based solder alloys;Microelectronics Reliability;2022-08

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