Low-Temperature Bonding of Copper by Copper Electrodeposition
Author:
Affiliation:
1. Graduate School of Engineering, Osaka University
2. Joining and Welding Research Institute, Osaka University
3. Faculty of Engineering, Osaka University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/63/6/63_MT-MC2022009/_pdf
Reference18 articles.
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3. 3) Y. Arai, M. Nimura and H. Tomokage: Trans. Japan Inst. Electron. Packag. 7 (2014) 8–13. doi:10.5104/jiepeng.7.8
4. 4) Y. Tian, C. Wang and Y.N. Zhou: Trans. Nonferrous Met. Soc. China 18 (2008) 132–137. doi:10.1016/S1003-6326(08)60024-2
5. 5) Y.F. Sun and H. Fujii: Mater. Sci. Eng. A 527 (2010) 6879–6886. doi:10.1016/j.msea.2010.07.030
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