Recent Development of Joining Materials, Methods of Reliability Evaluations and Conductive Materials for Electronic Components
Author:
Affiliation:
1. Graduate School of Science and Technology, Gunma University
2. Graduate School of Engineering, Muroran Institute of Technology
Publisher
Japan Institute of Metals
Link
https://www.jstage.jst.go.jp/article/matertrans/65/9/65_MT-M2024054/_pdf
Reference33 articles.
1. 1) Y. Kariya and I. Shohji: Special Issue on Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials, Mater. Trans. 57 (2016) 796. doi:10.2320/matertrans.MPR2016901
2. 2) I. Shohji and Y. Kariya: PREFACE, Mater. Trans. 60 (2019) 849. doi:10.2320/matertrans.MPR2019903
3. 3) I. Shohji and Y. Kariya: PREFACE, Mater. Trans. 63 (2022) 753. doi:10.2320/matertrans.MPR2022902
4. 4) T. Kobayashi and I. Shohji: Joining process of dissimilar materials using three-dimensional electrodeposited Ni-Cu film, Mater. Manuf. Process. 36 (2021) 1076–1083. doi:10.1080/10426914.2021.1885708
5. 5) Z. Li, H. Bian, C.M. Lee, X. Chen and Y.Y. Li: Nickel nanotube array via electroplating and dealloying, Thin Solid Films 658 (2018) 1–6. doi:10.1016/j.tsf.2018.05.015
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