1. Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging;Suga,2017
2. Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology;Beyne,2017
3. Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness;Jourdon,2018
4. Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding;Kagawa,2016
5. Scaling package interconnects below 20μm pitch with hybrid bonding;Gao,2018