1. System on integrated chips (SoIC (TM) for 3D heterogeneous integration;Chen;69th Electronic Components and Technology Conference, IEEE,2019
2. Ultra high density SoIC with sub-micron bond pitch;Chen;70th Electronic Components and Technology Conference, IEEE,2020
3. Enabling hybrid bonding on Intel process;Elsherbini;2021 International Electron Devices Meeting, IEEE,2021
4. Hybrid bonding interconnect for advanced heterogeneously integrated processors;Elsherbini;71st Electronic Components and Technology Conference, IEEE,2021
5. Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding;Kagawa;2016 International Electron Devices Meeting, IEEE,2016