Enabling Hybrid Bonding on Intel Process-Reference-Cited by-同舟云学术

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Enabling Hybrid Bonding on Intel Process

Published:2021-12-11 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE International Electron Devices Meeting (IEDM)
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Author:

Elsherbini Adel¹,Jun Kimin¹,Vreeland Richard¹,Brezinski William¹,Niazi Haris Khan²,Shi Yi²,Yu Qiang³,Qian Zhiguo²,Xu Jessica⁴,Liff Shawna²,Swan Johanna¹,Yao Jimin²,Liu Pilin⁴,Pelto Christopher⁵,Rami Said³,Balankutty Ajay³,Fischer Paul¹,Turkot Bob¹

Affiliation:

1. Intel Corporation,Components Research,USA

2. Intel Corporation,Assembly and Test Technology Development,USA

3. Intel Corporation,Design Enablement,USA

4. Intel Corporation,Corporate Quality Network,USA

5. Intel Corporation,Logic Technology Development,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9720433/9720494/09720586.pdf?arnumber=9720586

Reference6 articles.

1. Heterogeneous Integration Using Omni-Directional Interconnect Packaging

2. Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices

3. Protective Layer for Collective Die to Wafer Hybrid Bonding

4. Nondestructive Characterization of Fusion and Plasma Activated Wafer Bonding Using Mesa and Recess Structures

5. Hybrid Bonding Interconnect for Advanced Heterogeneously Integrated Processors

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding;Applied Surface Science;2024-11

2. A review on the development of ceria for chemical mechanical polishing;Powder Technology;2024-08

3. Technology Trend of CMP Process for Advance Packaging Application;Journal of The Japan Institute of Electronics Packaging;2024-08-01

4. In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures;Applied Surface Science;2024-07

5. Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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