1. Wafer Bonding
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3. Wafer direct bonding: tailoring adhesion between brittle materials
4. Moriceau H. Rieutord F. Morales C. Sartori S. Charvet A. M. , Surface Plasma Activation Before Direct Wafer Bonding: A Short Review and Recent Results,in Hobart K. D. Bengtsson S. Baumgart H. Suga T. Hunt C. E. (eds.), Semiconductor Wafer Bonding VIII: Science, Technology, and Applications, The Electrochemical Society, Inc., Pennington, New Jersey, pp. 34-49 (2005).
5. Chemical Free Room Temperature Wafer To Wafer Direct Bonding