Method to evaluate the adhesion distribution on wafers-Reference-Cited by-同舟云学术

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Method to evaluate the adhesion distribution on wafers

Published:2024-05-28 Issue: Volume: Page:1623-1627
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Hiratsuka Tatsumasa¹,Hirano Takaaki¹,Kotoo Kengo¹,Fujii Nobutoshi¹,Saito Suguru¹,Kobayashi Shoji¹,Hagimoto Yoshiya¹,Iwamoto Hayato¹

Affiliation:

1. Sony Semiconductor Solutions Corporations,Kanagawa,Japan

Funder

Research and Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564927.pdf?arnumber=10564927

Reference8 articles.

1. Bonding of silicon wafers for silicon‐on‐insulator

2. Novel Characterization Method of Chip Level Hybrid Bonding Strength

3. Measuring the surface bonding energy: A comparison between the classical double-cantilever beam experiment and its nanoscale analog

4. Characterization of Hysteresis of Surface Energy in Room-Temperature Direct Bonding Processes

5. Adhesion Energy and Bonding Wave Velocity Measurements

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