Funder
Semiconductor Research Corporation
National Science and Technology Council
Reference52 articles.
1. M.-F. Chen, F.-C. Chen, W.-C. Chiou, C. Doug, System on integrated chips (SoIC (TM) for 3D heterogeneous integration, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), IEEE, 2019, pp. 594-599. doi: 10.1109/ECTC.2019.00095.
2. Y. Chen, C. Yang, C. Kuo, M. Chen, C. Tung, W. Chiou, D. Yu, Ultra high density SoIC with sub-micron bond pitch, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), IEEE, 2020, pp. 576-581. doi: 10.1109/ECTC32862.2020.00096.
3. A. Elsherbini, K. Jun, R. Vreeland, W. Brezinski, H.K. Niazi, Y. Shi, Q. Yu, Z. Qian, J. Xu, S. Liff, Enabling hybrid bonding on intel process, 2021 IEEE International Electron Devices Meeting (IEDM), IEEE, 2021, pp. 34.3. 1-34.3. 4. doi: 10.1109/IEDM19574.2021.9720586.
4. Hybrid bonding interconnect for advanced heterogeneously integrated processors IEEE 71st Electronic Components and Technology Conference (ECTC);Elsherbini;IEEE,2021
5. Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applications IEEE 73rd Electronic Components and Technology Conference (ECTC);Kim;IEEE,2023
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献