Formation of Cu-Cu Joints with High Shear Strength and High Reliability in Air Atmosphere

Author:

Zhang Yudui1,Zhang Xu1,Wang Chuncheng2,Zhu Pengli1,Xiang Bin3,Zhao Tao1,Xu Liang1,Sun Rong1

Affiliation:

1. Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen,China

2. Osaka University,Joining and Welding Research Institute (JWRI),Osaka,Japan

3. University of Science and Technology of China,School of Chemistry and Materials Science,Hefei,China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Publisher

IEEE

Reference6 articles.

1. A study on the Identification of Copper Tube Joint Defects Based on Neural Network using Thermal Image Data;kim;J Korea Soc Mech Technol,2022

2. Synthesis of Air-Sinterable Copper Nanoparticles for Die-Attachment

3. Reconstructing more sinterable surfaces for copper nanoparticles to form high-strength Cu-Cu joints in air atmosphere

4. Ultrafast Laser Patterning Deposition of Micron Sliver Bumps for Chip Bonding Application;wu;Chinese J Lasers,2022

5. Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint

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1. Synthesis and characterization of highly-dispersed copper submicron particles for low temperature sintering joints;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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