Synthesis and characterization of highly-dispersed copper submicron particles for low temperature sintering joints-Reference-Cited by-同舟云学术

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Synthesis and characterization of highly-dispersed copper submicron particles for low temperature sintering joints

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Fang Yi¹,Yang Fan²,Du Jianjun²,Fu Bicheng¹,Qi Fang³,Li ZhengYu³,Cao Haiyang³,Xu Haipeng³,Li Mingyu¹

Affiliation:

1. Harbin Institute of Technology (Shenzhen),Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering,Shenzhen,China

2. Harbin Institute of Technology (Shenzhen),School of Mechanical Engineering and Automation,Shenzhen,China

3. NIO,Hefei,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492233.pdf?arnumber=10492233

Reference9 articles.

1. Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

2. Abnormal swelling behavior of sintering nano-Ag joint during high-temperature ageing

3. Extraordinarily enhanced sintering performance of pressureless sinterable Cu nanoparticle paste for achieving robust die-attach bonding by using reducing hybrid solvent

4. Formation of Cu-Cu Joints with High Shear Strength and High Reliability in Air Atmosphere

5. High strength and density Cu-Cu joints formation by low temperature and pressure sintering of different mass ratio of Cu micron-nanoparticles paste

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