Extraordinarily enhanced sintering performance of pressureless sinterable Cu nanoparticle paste for achieving robust die-attach bonding by using reducing hybrid solvent-Reference-Cited by-同舟云学术

Extraordinarily enhanced sintering performance of pressureless sinterable Cu nanoparticle paste for achieving robust die-attach bonding by using reducing hybrid solvent

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Huang Hai-Jun,Zhou Min-Bo,Zhang Xin-Ping

Funder

National Natural Science Foundation of China

Research Fund for the Science and Technology Planning Project of Guangzhou City

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501773.pdf?arnumber=9501773

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