Abnormal swelling behavior of sintering nano-Ag joint during high-temperature ageing
Author:
Affiliation:
1. Harbin Institute of Technology (Shenzhen),Sauvage Laboratory for Smart Materials,Shenzhen,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873319.pdf?arnumber=9873319
Reference8 articles.
1. Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
2. An explanation of sintered silver bonding formation on bare copper substrate in air
3. Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications
4. Metal?metal bonding process using Ag metallo-organic nanoparticles
5. Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Microstructure evolution and fracture mechanism of sintered nano-Ag joints on bare copper during high temperature aging;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Synthesis and characterization of highly-dispersed copper submicron particles for low temperature sintering joints;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
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