Synthesis of Air-Sinterable Copper Nanoparticles for Die-Attachment-Reference-Cited by-同舟云学术

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Synthesis of Air-Sinterable Copper Nanoparticles for Die-Attachment

Published:2021-09-14 Issue: Volume: Page:
ISSN:
Container-title:2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Yao Yue,Xu Liang,Zhu Pengli,Zhao Tao,Sun Rong,Huo Yinachao

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangdong

Shenzhen basic research plan

SIAT Innovation Program for Excellent Young Researchers

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9567715/9567716/09567949.pdf?arnumber=9567949

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pressure-less Copper Sintering Paste for Die Attach Application;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Pressure Copper Sintering Paste for High-Power Device Die-Attach Applications;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Formation of Cu-Cu Joints with High Shear Strength and High Reliability in Air Atmosphere;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. Reconstructing more sinterable surfaces for copper nanoparticles to form high-strength Cu-Cu joints in air atmosphere;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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