Evaluation of Ultrasonic Vibration Energy on Cu-Cu Direct Bonding for Flip-Chip Interconnection
Author:
Affiliation:
1. Department of Electronics Engineering and Computer Science, Fukuoka University
2. Research and Development Div., Toray Engineering Co., Ltd.
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiepeng/7/1/7_8/_pdf
Reference11 articles.
1. [1] L. Miller, "Controlled Collapse Reflow Chip Joining," IBM Journal of Research & Development, Vol. 13, pp. 239-250, 1969.
2. [2] Y. Orii, K. Toriyama, H. Noma, Y. Oyama, H. Nishiwaki, M. Ishida, T. Nishio, N. C. LaBianca, and C. Feger, "Ultrafine-Pitch C2 Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps," Proceedings of the 59th ECTC Conference, pp. 948-953, 2009.
3. [3] J.-W. Nah, J. O. Suh, K. N. Tu, S. W. Yoon, V. S. Rao, V. Kripesh, and F. Hua, "Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect," Journal of Applied Physics, Vol. 100, p. 123513, 2006.
4. [4] L. Xu, S. W. Liang, D. Xu, J.-K. Han, J. Liang, and K. N. Tu, "Electromigration Failure with Thermal Gradient Effect in SnAgCu Solder Joints with Various UBM," Proceedings of the 59th ECTC Conference, pp. 909-913, 2009.
5. [5] K. N. Chen, A. Fan, C. S. Tan, and R. Reif, "Temperature and duration effect on microstructure evolution during copper wafer bonding," Journal of Electronic Materials, Vol. 32, pp. 1371-1374, 2003.
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