Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates

Author:

Roshanghias AliORCID,Rodrigues Augusto Daniel,Holzmann Dominik

Funder

Federal Ministries of Climate Action, Environment, Energy, Mobility, Innovation and Technology

Austrian Research Promotion Agency

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Printed paper–based electrochemical sensors for low-cost point-of-need applications;Smith;Electrocatalysis,2019

2. Inkjet printing and characterisation of a resistive temperature sensor on paper substrate;Zikulnig;Flex. Print. Electron.,2019

3. Flipchip bonding of thin Si dies onto PET foils: possibilities and applications;van den Brand,2011

4. Roll-to-roll printed electronics on paper;Bollström,2012

5. Thermosonic-adhesive flip-chip assembly;Dou,2012

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