Wafer bumping of Sn-Ag micro-bumps with high coplanarity
Author:
Affiliation:
1. Dalian University of Technology,Electronic Packaging Materials Laboratory, School of Materials Science & Engineering,Dalian,China
2. Dalian University of Technology,Experiment Center of Chemistry, School of Chemical Engineering,Dalian,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492371.pdf?arnumber=10492371
Reference8 articles.
1. Dissolution and precipitation of Ag3Sn plates in ultra fine solder joints using synchrotron radiation real-time imaging technology
2. Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates
3. Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn–3.5Ag solder bumps
4. Fabrication of electroplate Sn-Ag bumps without a lithography process for 3D packaging
5. Development of a new indium bump fabrication method for large-area HgCdTe detector
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