Development of a new indium bump fabrication method for large-area HgCdTe detector
Author:
Publisher
SPIE
Reference8 articles.
1. Next decade in infrared detectors;Rogalski,2017
2. Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection
3. Infrared and Laser Engineering
4. Aspects of Indium Solder Bumping and Indium Bump Bonding Useful for Assembling Cooled Mosaic Sensors
5. Progress in focal plane array technologies
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