Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn–3.5Ag solder bumps

Author:

Zhao Qinghua,Hu Anmin,Li Ming,Sun Jiangyan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Evaluation of Cu-bumps with lead-free solders for flip-chip package applications;Lin;Microelectron Eng,2009

2. A study in flip-chip UBM/bump reliability with effects of SnPb solder composition;Wu;Microelectron Reliab,2006

3. Umemoto M, Tanida K, Nemoto Y, Hoshino M, Kojima K, Shirai Y, Takahashi K. High-performance vertical interconnection for high-density 3D chip stacking package. In: IEEE, vol. 611. 2004. p. 616–23.

4. Development of 3-D silicon module with TSV for system in packaging components and packaging technologies;Khan;IEEE Trans,2010

5. Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate;Wang;Intermetallics,2010

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