Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference25 articles.
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2. Phase diagrams of Pb-free solders and their related materials;Chen;J Mater Sci Mater Electron,2007
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4. Advances in lead-free electronics soldering;Suganuma;Curr Opin Solid State Mater Sci,2001
5. Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification;Shen;Intermetallics,2008
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