Evaluation of Cu-bumps with lead-free solders for flip-chip package applications-Reference-Cited by-同舟云学术

Evaluation of Cu-bumps with lead-free solders for flip-chip package applications

Published:2009-12 Issue:12 Volume:86 Page:2392-2395
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Lin Kung-Liang,Chang Edward-Yi,Shih Lin-Chi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Tin–lead (SnPb) solder reaction in flip chip technology

2. European Union, Waste in Electrical and Electronic Equipment (WEEE) Directive, Tech. Rep., Third Draft, May 2000.

3. Pb‐free solder bumping for flip chip package by electroplating

4. Y. Arai, M. Sato, H.T. Yamada, T. Hamada, K. Nagai, H.I. Fujishxo, in: 1997 IEEE MTT-S International Microwave Symposium Digest, Denver, CO, June 1997, pp. 447–450.

5. TRW, Automotive Electronics Group, Redondo Beach, CA, in: IEEE MTT-S Digest, 1995, pp. 1591–1594.

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