Synergy effect of mixed sintering accelerator on the deoxidation and sintering property improvement of Cu nanoparticles at low temperature-Reference-Cited by-同舟云学术

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Synergy effect of mixed sintering accelerator on the deoxidation and sintering property improvement of Cu nanoparticles at low temperature

Published:2021-09-22 Issue:10 Volume:127 Page:
ISSN:0947-8396
Container-title:Applied Physics A
language:en
Short-container-title:Appl. Phys. A

Author:

Zhang Yu,Cao Ping,Lin Wei,Liu Qiang,Chen Ziyuan,Cao Jun,Yang Guannan^ORCID,Cui Chengqiang

Funder

open project of the state key laboratory of advanced materials and electronic components

national natural science foundation of china

guangdong basic and applied basic research

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science,General Chemistry

Link

https://link.springer.com/content/pdf/10.1007/s00339-021-04924-9.pdf

Reference30 articles.

1. V.R. Manikam, K.Y. Cheong, Die attach materials for high temperature applications: a review. Ieee Trans. Compon. Packag. Manuf. Technol. 1, 457 (2011)

2. A. Hu, J.Y. Guo, H. Alarifi, G. Patane, Y. Zhou, G. Compagnini, C.X. Xu, Low temperature sintering of Ag nanoparticles for flexible electronics packaging. Appl. Phys. Lett. 97, 153117 (2010)

3. J. Fan, T. Shi, XiangXu Tao, T. Zhou, J. Li, Z. Tang, G. Liao, Yu. Xing, The Cu-Cu self-propagating reaction joining with different thickness of tin. J. Alloys Compd. 735, 1189 (2018)

4. B.U. Hwang, K.H. Jung, K.D. Min, C.J. Lee, S.B. Jung, Pressureless Cu-Cu bonding using hybrid Cu-epoxy paste and its reliability. J. Mater. Sci.-Mater. Electron. 32, 3054 (2021)

5. Y. Liu, Fu. Haifeng, F. Sun, H. Zhang, X. Kong, T. Xin, Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes. J. Mater. Process. Technol. 238, 290 (2016)

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