Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes-Reference-Cited by-同舟云学术

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Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes

Published:2016-12 Issue: Volume:238 Page:290-296
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Liu Yang^ORCID,Fu Haifeng,Sun Fenglian,Zhang Hao,Kong Xiangxia,Xin Tong

Funder

Research and Scientific Foundation of Heilongjiang Education Department

University Nursing Program for Young Scholars with Creative Talents in Heilongjiang Province

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference11 articles.

1. Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn-Bi based lead-free solder;Chen;J. Alloy. Compd.,2015

2. Synthesis and melting behaviour of Bi, Sn and Sn-Bi nanostructured alloy;Frongia;J. Alloy. Compd.,2015

3. Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints;Goh;J. Mater. Sci.,2015

4. Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate;Kanlayasiri;Mater. Design,2015

5. Solderability IMC evolution, and shear behavior of low-Ag Sn0. 7Ag0. 5Cu-BiNi/Cu solder joint;Liu;J. Mater. Sci. Mater. Electron.,2012

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-reliability Sn37Pb/Sn58Bi composite solder joints by solid-liquid low-temperature soldering;Materials Today Communications;2024-12

2. Microstructure and shear properties of interconnect interface between multi-phase heterogeneous SnBi eutectic alloy and Cu substrate;Journal of Alloys and Compounds;2024-11

3. Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints;Scientific Reports;2024-07-08

4. Covalent electrografting of aryl groups on AA2060-T8 surfaces, and their modification with Ce(4OHcin)3 to incorporate additional anticorrosive activity;Journal of Materials Research and Technology;2024-07

5. The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder;Journal of Materials Research and Technology;2024-03

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