A Mini Review on the Microvia Filling Technology Based on Printed Metal Nano/Microparticles

Abstract

Microvia filling is a core interconnection technique in electronic manufacturing. Electroplating is the primary method used in the industry for filling microvias but also has the drawbacks of cumbersome procedures and toxic by-products. New microvia filling technology through printing of metal particle–based conductive fillers was then developed, with the advantages of simpler process, higher efficiency, better compatibility, and eco-friendliness. Here, we review the up-to-date research findings on the microvia filling technology based on printed metal nano/microparticles from the perspectives of material development and filling performance. Some key questions about this technology are also discussed. We hope the outlook presented by this review could help the further studies on this topic. The review also identifies some key remaining issues to be resolved.