The effects of pressure, temperature, and depth/diameter ratio on the microvia filling performance of Ag-coated Cu micro-nanoparticles for advanced electronic packaging-Reference-Cited by-同舟云学术

The effects of pressure, temperature, and depth/diameter ratio on the microvia filling performance of Ag-coated Cu micro-nanoparticles for advanced electronic packaging

Published:2022-08-02 Issue:4 Volume:13 Page:543-560
ISSN:1947-5411
Container-title:International Journal of Smart and Nano Materials
language:en
Short-container-title:International Journal of Smart and Nano Materials

Author:

Yang Guannan¹²,Luo Shaogen¹,Luo Bo¹,Zuo Yan¹,Ta Shiwo³,Lin Tingyu⁴,Zhao Zhaohui⁵,Zhang Yu¹²,Cui Chengqiang¹²

Affiliation:

1. State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, Guangdong, China

2. Jihua Laboratory, Foshan, Guangdong, China

3. State Key Laboratory of Advanced Materials and Electronic Components, Fenghua Advanced Technology Co. Ltd, Zhaoqing, Guangdong, China

4. Guangdong Fozhixin Microelectronics Technology Research Co. Ltd, Foshan, Guangdong, China

5. Beijing Compo Advanced Technology Co. Ltd, Beijing, China

Funder

National Natural Science Foundation of China

Key-area Research and Development Program of Guangdong Province

Open Project of the State Key Laboratory of Advanced Materials and Electronic Components

Guangdong Basic and Applied Basic Research

Publisher

Informa UK Limited

Subject