Low temperature sintering of Ag nanoparticles for flexible electronics packaging
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3502604
Reference19 articles.
1. Cold welding of ultrathin gold nanowires
2. Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems
3. Metal?metal bonding process using Ag metallo-organic nanoparticles
4. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles
5. Effects of Silver Oxide Addition on the Electrical Resistivity and Microstructure of Low-Temperature-Curing Metallo-Organic Decomposition Silver Pastes
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