Effects of Silver Oxide Addition on the Electrical Resistivity and Microstructure of Low-Temperature-Curing Metallo-Organic Decomposition Silver Pastes-Reference-Cited by-同舟云学术

Effects of Silver Oxide Addition on the Electrical Resistivity and Microstructure of Low-Temperature-Curing Metallo-Organic Decomposition Silver Pastes

Published:2007-07-04 Issue:7A Volume:46 Page:4179-4183
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Lu Chun-An,Lin Pang,Lin Hong-Ching,Wang Sea-Fue

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference10 articles.

1. An Ink-Jet-Deposited Passive Component Process for RFID

2. Progress Toward Development of All-Printed RFID Tags: Materials, Processes, and Devices

3. Metallization of solar cells with ink jet printing and silver metallo-organic inks

4. Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste

5. Characterization of the Low-Curing-Temperature Silver Paste with Silver 2-Ethylhexanoate Addition

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