Effects of Silver Oxide Addition on the Electrical Resistivity and Microstructure of Low-Temperature-Curing Metallo-Organic Decomposition Silver Pastes-Reference-Cited by-同舟云学术

Effects of Silver Oxide Addition on the Electrical Resistivity and Microstructure of Low-Temperature-Curing Metallo-Organic Decomposition Silver Pastes

Published:2007-07-04 Issue:7A Volume:46 Page:4179-4183
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Lu Chun-An,Lin Pang,Lin Hong-Ching,Wang Sea-Fue

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference10 articles.

1. An Ink-Jet-Deposited Passive Component Process for RFID

2. Progress Toward Development of All-Printed RFID Tags: Materials, Processes, and Devices

3. Metallization of solar cells with ink jet printing and silver metallo-organic inks

4. Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste

5. Characterization of the Low-Curing-Temperature Silver Paste with Silver 2-Ethylhexanoate Addition

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Performance and Reliability of SMD Interconnections using Low-Temperature Solders and ECAs for FHE Applications;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

2. Process Recipes for SMD Interconnection on Aqueous Conductive Inks using Direct-Write Printing;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

3. Sustainable-Ink Process Recipes for the Fabrication of Additively Printed Circuits and Component Attachment;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Superconducting Flexible Organic/Inorganic Hybrid Compound Adhesives;ACS Omega;2022-12-07

5. Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31