Formation of Wavy Crack in Double-Layered Ag and CuO/Ag Sintering Die Attach Assemblies Subjected to Thermal Shock Testing-Reference-Cited by-同舟云学术

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Formation of Wavy Crack in Double-Layered Ag and CuO/Ag Sintering Die Attach Assemblies Subjected to Thermal Shock Testing

Published:2024-04 Issue:4 Volume:14 Page:593-600
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Yasugi Daisuke¹,Wakamoto Keisuke¹,Kumakiri Yuga¹,Namazu Takahiro²^ORCID

Affiliation:

1. Graduate School of Engineering, Kyoto University of Advanced Science, Kyoto, Japan

2. Faculty of Engineering, Kyoto University of Advanced Science, Kyoto, Japan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10523000/10479535.pdf?arnumber=10479535

Reference39 articles.

1. Review of Silicon Carbide Power Devices and Their Applications

2. An assessment of wide bandgap semiconductors for power devices

3. SiC versus Si—Evaluation of Potentials for Performance Improvement of Inverter and DC–DC Converter Systems by SiC Power Semiconductors

4. High-temperature electronics - a role for wide bandgap semiconductors?

5. Assembly and Packaging Technologies for High-Temperature and High-Power GaN Devices

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1. Mechanical Characterization of Sintered Silver Materials for Power Device Packaging: A Review;Energies;2024-08-18

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