Assembly and Packaging Technologies for High-Temperature and High-Power GaN Devices-Reference-Cited by-同舟云学术

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Assembly and Packaging Technologies for High-Temperature and High-Power GaN Devices

Published:2015-10 Issue:10 Volume:5 Page:1402-1416
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Bajwa Adeel Ahmad¹,Qin Yangyang²,Reiner Richard³,Quay Rudiger³,Wilde Jurgen¹

Affiliation:

1. Laboratory for Assembly and Packaging Technology, Institut für Mikrosystemtechnik, University of Freiburg, Freiburg im Breisgau, Germany

2. Micro Systems Engineering GmbH, Berg, Germany

3. Fraunhofer Institute of Applied Solid-State Phyiscs, Freiburg im Breisgau, Germany

Funder

Fritz Hüttinger Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/7284722/07243341.pdf?arnumber=7243341

Cited by 54 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review of Die-Attach Materials for SiC High-Temperature Packaging;IEEE Transactions on Power Electronics;2024-10

2. Exploring the process-microstructure-thermal properties relationship of resin-reinforced Ag sintering material for high-power applications via 3D FIB-SEM nanotomography;Materials & Design;2024-08

3. Degradation in Electrothermal Characteristics and Failure Mechanism of SiC JBS With Different Die Attach Materials Under 300 ^∘C Power Cycle Stress;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08

4. Design and Optimization of 100 V GaN Multi-chip Power Micromodule Based on AlN DBC Substrate;2024 IEEE 25th International Conference of Young Professionals in Electron Devices and Materials (EDM);2024-06-28

5. Investigating Sintering Mechanism of 100 nm Ag Nanoparticles via In-situ SEM Observation and Phase Field Simulation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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