Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps-Reference-Cited by-同舟云学术

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Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps

Published:2009-05 Issue: Volume: Page:
ISSN:
Container-title:2009 59th Electronic Components and Technology Conference
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Author:

Orii Yasumitsu,Toriyama Kazushige,Noma Hirokazu,Oyama Yukifumi,Nishiwaki Hidetoshi,Ishida Mitsuya,Nishio Toshihiko,LaBianca Nancy C.,Feger Claudius

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5066986/5073977/05074127.pdf?arnumber=5074127

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review;Materials;2023-12-14

2. Benchmarking Frequency-Dependent Parasitics of Fine-Pitch Off-Chip I/Os for 2.5D and 3D Heterogeneous Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-12

3. Effects of Commercial No-Clean Flux on Reliability of Fine Pitch Flip-Chip Package With Solder Bumps and Copper Pillars;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-08

4. A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly Using a Socketed Platform, Compressible MicroInterconnects, and Self-Alignment;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-12

5. Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration;Journal of Electronic Packaging;2021-11-22

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