Effects of Commercial No-Clean Flux on Reliability of Fine Pitch Flip-Chip Package With Solder Bumps and Copper Pillars-Reference-Cited by-同舟云学术

Effects of Commercial No-Clean Flux on Reliability of Fine Pitch Flip-Chip Package With Solder Bumps and Copper Pillars

Published:2022-08 Issue:8 Volume:12 Page:1386-1394
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Wakeel Saif¹^ORCID,Haseeb A. S. M. A.¹^ORCID,Hoon Khoo Ly²,Amalina M. A.³

Affiliation:

1. Department of Mechanical Engineering, Center of Advanced Materials, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia

2. Assembly Process Innovation, NXP Semiconductor Sdn. Bhd., Petaling Jaya, Selangor, Malaysia

3. Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference35 articles.

4. Processing and reliability of low cost flip chip assemblies implementing fast-flow, snap-cure underfills;houston;Proc 48th SMTA Conf Expo,1999

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