Bondability of Gold Wire to Gold-Plated Electrodes-Reference-Cited by-同舟云学术

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Bondability of Gold Wire to Gold-Plated Electrodes

Published:1993 Issue:10 Volume:34 Page:960-965
ISSN:0916-1821
Container-title:Materials Transactions, JIM
language:en
Short-container-title:Mater. Trans., JIM

Author:

Haji Hiroshi¹,Morita Toshiaki¹,Arita Kiyoshi²,Nakashima Hideharu¹,Yoshinaga Hideo¹

Affiliation:

1. Department of Materials Science and Technology, Graduate School of Engineering Sciences, Kyushu University

2. Production Engineering Laboratory, Kyushu Matsushita Electric Co., Ltd.

Publisher

Japan Institute of Metals

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/matertrans1989/34/10/34_10_960/_pdf

Reference8 articles.

1. 1) L. Missel: Met. Finishing, 73 (1975), 69.

2. 2) N. T. Panousis and P. M. Hall: Electronic Components Conf., 26 (1976), 74.

3. 3) W. A. Fairweather: Trans. IMF, 64 (1986), 15.

4. 4) I. R. Christie: Trans. IMF, 64 (1986), 47.

5. 5) Z. Mathe: Met. Finishing, 90 (1992), 33.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding;IEEE Transactions on Advanced Packaging;2005-11

2. Process windows for low-temperature Au wire bonding;Journal of Electronic Materials;2004-02

3. Effects of metallization characteristics on gold wire bondability of organic printed circuit boards;Journal of Electronic Materials;2001-08

4. Investigation of Low Loss and High Reliability Encapsulation Technology in Large-Area, High-Power Semiconductor Devices;Japanese Journal of Applied Physics;1999-11-01

5. Influence of surface cleanness on ultrasonic ball bondability of Au wire on to Au, Cu and Al pads;Welding International;1998-01

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