1. J.K. Kim and B.P.L. Au, J. Electron. Mater. 30, 1001 (2001).
2. H.M. Ho, C.K. Yeo, S.L. Chan, N. Wong, C.C. Ng, C.S. Ramanujan, and K. Li, Proc. 2nd Electronic Packaging Technology Conf. (Piscataway, NJ: IEEE, 1998), pp. 190–195.
3. G.G. Harman, Wire Bonding in Microelectronics: Materials, Processes, Reliability and Yield, 2nd ed. (New York: McGraw Hill, 1997), pp. 171, 173, 267.
4. C. Dunn, R.W. Johnson, and M. Bozack, 1997 Int. Conf. on Multichip Modules (New York: IEEE, 1997), pp. 170–176.
5. D.W. Bushmire and P.H. Holloway, Proc. 1975 Int. Symp. on Microelectronics (Orlando, FL: ISHM, 1975), pp. 402–407.