Wire Bonding Novel 3D Air-Metal Dielectric Structures with ISIG Passivation: Process Development and Reliability
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-92381-5_104
Reference14 articles.
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5. Ng BT, Ganesh VP, Lee C (2006) Optimization of gold wire bonding on electroless nickel immersion gold for high temperature applications. In: 2006 8th electronics packaging technology conference, pp 277–282. https://doi.org/10.1109/EPTC.2006.342729
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