Effects of bonding frequency on Au wedge wire bondability-Reference-Cited by-同舟云学术

Effects of bonding frequency on Au wedge wire bondability

Published:2007-05-31 Issue:3 Volume:19 Page:281-288
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Chan Yu Hin,Kim Jang-Kyo,Liu Deming,Liu Peter C. K.,Cheung Yiu Ming,Ng Ming Wai

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-007-9312-7.pdf

Reference14 articles.

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4. H.M. Ho, C.K. Yeo, S.L. Chan, N. Wong, C.C. Ng, C.S. Ramanujan, K. Li, in Proceedings of the 2nd Electronics Packaging Technology Conference, 190 (1998)

5. Y. Shirai, K. Otsuka, T. Araki, I. Seki, K. Kikuchi, N. Fujita, T. Miwa, in Proceedings of the ICEMM, 366 (1993)

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