Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Author:

Yu Hin Chan ,Jang-Kyo Kim ,Deming Liu ,Liu P.C.K.,Yiu-Ming Cheung ,Ming Wai Ng

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Bond-pad damage in ultrasonic wedge bonding;Microelectronics Reliability;2024-01

2. Hardware Security Assessment through Repair of Damaged Device;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

3. The Resarch of Gold Wire Ball-Welding Process Based on the Ni-Pd-Au Film;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. The Impact of Gold Plating Process for Bonding Pads on Interconnection Quality;IEEE Transactions on Device and Materials Reliability;2022-03

5. The photoluminescence characteristics of GaAs surface by plasma treatment;Materials Science in Semiconductor Processing;2021-11

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