The Impact of Gold Plating Process for Bonding Pads on Interconnection Quality-Reference-Cited by-同舟云学术

The Impact of Gold Plating Process for Bonding Pads on Interconnection Quality

Published:2022-03 Issue:1 Volume:22 Page:65-72
ISSN:1530-4388
Container-title:IEEE Transactions on Device and Materials Reliability
language:
Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Wang Ziren¹^ORCID,Gao Jinchun¹^ORCID,Wang Wenjia¹,Bilal Hafiz M.¹,Wu Yongle¹^ORCID,Wang Chen²^ORCID

Affiliation:

1. School of Electronic Engineering and the Beijing Key Laboratory of Work Safety Intelligent Monitoring, Beijing University of Posts and Telecommunications, Beijing, China

2. China Telecommunication Technology Labs, China Academy of Information and Communications Technology, Beijing, China

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/7298/9730817/09695964.pdf?arnumber=9695964

Reference27 articles.

1. Roughness Enhanced Au Ball Bonding of Cu Substrates

2. Defect analysis of ultrasonic al wire bonds on Ni-plated package leads

3. Effect of electroless palladium immersion gold deposit properties on gold wire bonding

4. Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

5. Investigation of the improvement of signal integrity in electrical circuits with degraded contacts using differential transmission

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on the preparation mechanism and property analysis of a localized Au coating by laser-induced cyanide-free electroplating;Journal of Materials Science: Materials in Electronics;2024-05