Influence of surface cleanness on ultrasonic ball bondability of Au wire on to Au, Cu and Al pads

Author:

Kajiwara R,Takahashi T,Tsubosaki K,Watanabe H

Publisher

Informa UK Limited

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference8 articles.

1. Energy-Free Bonding of Materials with Fine Controlled Surfaces in Ultrahigh Vacuum

2. Suga, T, Fujiwaka, T and Sasaki, G. ‘Surface activated bonding and its application in micro-bonding at room temperature’. Proc 9th Euro ‘Hybrid microelectron’ conf. pp.314–321.

3. Effect of Argon Ion Bombardment on Diffusion Bonding Joints of Cu or Ti

4. Buckles, S L. ‘Use of argon plasma for cleaning hybrid circuits prior to wire bonding’. Proc 5th int ‘Microelectron’ conf. pp.383–387.

5. Bondability of Gold Wire to Gold-Plated Electrodes

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