Author:
Kajiwara R,Takahashi T,Tsubosaki K,Watanabe H
Subject
Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference8 articles.
1. Energy-Free Bonding of Materials with Fine Controlled Surfaces in Ultrahigh Vacuum
2. Suga, T, Fujiwaka, T and Sasaki, G. ‘Surface activated bonding and its application in micro-bonding at room temperature’. Proc 9th Euro ‘Hybrid microelectron’ conf. pp.314–321.
3. Effect of Argon Ion Bombardment on Diffusion Bonding Joints of Cu or Ti
4. Buckles, S L. ‘Use of argon plasma for cleaning hybrid circuits prior to wire bonding’. Proc 5th int ‘Microelectron’ conf. pp.383–387.
5. Bondability of Gold Wire to Gold-Plated Electrodes
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