Evolution of Electrical Conductivity in Silver-Loaded Electrically Conductive Adhesives Composed of an Amine-Cured Epoxy-Based Binder
Author:
Affiliation:
1. Graduate School of Science and Technology, Gunma University
2. Advanced Scientific Research Leaders Development Unit, Gunma University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/57/6/57_MD201511/_pdf
Reference19 articles.
1. 1) I. Mir and D. Kumar: Int. J. Adhes. Adhes. 28 (2008) 362–371. 10.1016/j.ijadhadh.2007.10.004
2. 2) M. Sumita, K. Sakata, Y. Hayakawa, S. Asai and K. Miyasaka: Colloid Polym. Sci. 270 (1992) 134–139. 10.1007/BF00652179
3. 3) Y. Fu, J. Liu and M. Willander: Int. J. Adhes. Adhes. 19 (1999) 281–286. 10.1016/S0143-7496(98)00071-2
4. 4) O. Arao, A. Shintai and A. Sugiura: J. Jpn. Inst. Electron. Packag. 16 (2013) 127–135 (in Japanese). 10.5104/jiep.16.127
5. 5) J. E. Morris: Conductive Adhesives for Electronics Packaging (ed. J. Liu), (Electrochemical Publications, Port Erin, 1999) pp 36–77.
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