Conduction modelling of a conductive adhesive with bimodal distribution of conducting element
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Evolution of Electrical Conductivity in Silver-Loaded Electrically Conductive Adhesives Composed of an Amine-Cured Epoxy-Based Binder;MATERIALS TRANSACTIONS;2016
2. Development of particle dispersion technique for hybrid size conductivity model;Asia-Pacific Journal of Chemical Engineering;2015-11-11
3. Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications;Adhesion in Microelectronics;2014-09-12
4. High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package;International Journal of Adhesion and Adhesives;2013-07
5. Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives;Electronic Materials Letters;2013-05
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