Recent advances in isotropic conductive adhesives for electronics packaging applications-Reference-Cited by-同舟云学术

Recent advances in isotropic conductive adhesives for electronics packaging applications

Published:2008-10 Issue:7 Volume:28 Page:362-371
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Mir Irfan,Kumar D.

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference135 articles.

1. Solders and soldering materials, design, production and analysis for reliable bonding;Manko,1979

2. Soldering in electronics;Wassink,1984

3. Handbook of microelectronics packaging and interconnection technologies;Sinnadurai,1985

4. Wong CP, Daoqiang Lu. In: Proceedings of the fourth international conference on adhesive joining and coating technology in electronics manufacturing, Espoo: Finland, 2000. p. 121.

5. Get the lead out! [lead free solder]

Cited by 152 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives;ACS Applied Materials & Interfaces;2023-12-19

2. Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives;Microelectronics Reliability;2023-12

3. Correlation between the Structural Variations in Thiol-Based Hardeners and Properties of Thiol–Epoxy Polymers;ACS Applied Polymer Materials;2023-10-10

4. Performance and Reliability of SMD Interconnections using Low-Temperature Solders and ECAs for FHE Applications;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

5. Process Recipes for SMD Interconnection on Aqueous Conductive Inks using Direct-Write Printing;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30