Change in electrical conductivity of electrically conductive adhesives during curing process
Author:
Funder
JSPS KAKENHI
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s10853-022-07305-6.pdf
Reference18 articles.
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2. Scher H, Zallen R (1970) Critical density in percolation processes. J Chem Phys 53:3759–3761. https://doi.org/10.1063/1.1674565
3. Janzen J (1975) On the critical conductive filler loading in antistatic composites. J App Phys 46:966–969. https://doi.org/10.1063/1.321629
4. Daoqiang L, Wong CP (2000) Effects of shrinkage on conductivity of isotropic conductive adhesives. Int J Adhes Adhes 20:189–193. https://doi.org/10.1016/S0143-7496(99)00039-1
5. Daoqiang L, Tong QK, Wong CP (1999) Conductivity mechanisms of isotropic conductive adhesives (ICA’s). IEEE Trans Electron Packag Manuf 22(3):223–227. https://doi.org/10.1109/6104.795857
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