Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives-Reference-Cited by-同舟云学术

Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives

Published:2022-10-31 Issue:11 Volume:4 Page:5387-5396
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Zhang Weiwei¹²^ORCID,Liu Jiahao³,Liu Hao¹⁴,Wang Jianqiang¹²,Zhang Luobin¹²,Wang Jintao¹²,Wang Haozhong¹²,Wang Fengyi¹²,Wang Xinjie¹²,Yu Fuwen¹²,Lv Ziwen¹²,Zhang Zheng¹²,Hang Chunjin⁵,Li Mingyu¹²^ORCID,Chen Hongtao¹²

Affiliation:

1. Department of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China

2. Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China

3. China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, China

4. Beijing Santel Technology & Trading Corp, Beijing 100039, China

5. State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

Funder

Natural Science Foundation of Guangdong Province

Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.2c01055

Reference49 articles.

1. A study of lubricants on silver flakes for microelectronics conductive adhesives

2. Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids

3. Development of Electrical Conduction in Silver-filled Epoxy Adhesives

4. A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces

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