Superstable, High-Conductivity Cu Conductive Adhesive-Reference-Cited by-同舟云学术

Superstable, High-Conductivity Cu Conductive Adhesive

Published:2023-12-01 Issue:12 Volume:5 Page:6621-6629
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Dai Dongfang¹^ORCID,Wang Zeping¹,Yu Jiabing¹^ORCID,Wang Xiao¹,Chen Xianping¹²

Affiliation:

1. College of Optoelectronic Engineering and Key Laboratory of Optoelectronic Technology & Systems Education Ministry of China, Chongqing University, 400044 Chongqing, China

2. School of Electrical Engineering and State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, 400044 Chongqing, China

Funder

National Natural Science Foundation of China

Guangxi Key Laboratory of Optoelectronic Information Processing, Guilin University of Electronic Technology

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.3c01150

Reference40 articles.

1. A review on epoxy-based electrically conductive adhesives

2. Recent advances in nano-materials for packaging of electronic devices

3. UV Curable Conductive Ink for the Fabrication of Textile-Based Conductive Circuits and Wearable UHF RFID Tags

4. Ternary Ag/Epoxy Adhesive with Excellent Overall Performance

5. One-Step Preparation of Silver Hexagonal Microsheets as Electrically Conductive Adhesive Fillers for Printed Electronics

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