Ternary Ag/Epoxy Adhesive with Excellent Overall Performance-Reference-Cited by-同舟云学术

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Ternary Ag/Epoxy Adhesive with Excellent Overall Performance

Published:2015-04-13 Issue:15 Volume:7 Page:8041-8052
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Ji Yan-Hong¹²,Liu Yu¹,Huang Gui-Wen¹,Shen Xiao-Jun³,Xiao Hong-Mei¹,Fu Shao-Yun¹

Affiliation:

1. Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China

2. University of Chinese Academy of Sciences, Beijing 100049, China

3. Materials and Textile Engineering College, Jiaxing University, Jiaxing 314001, Zhejiang Province China

Funder

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.5b00470

Reference49 articles.

1. Electronics Without Lead

2. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

3. Recent advances in isotropic conductive adhesives for electronics packaging applications

4. Synthesis of contamination-free silver nanoparticle suspensions for micro-interconnects

5. Recent Advances in Developing High Performance Isotropic Conductive Adhesives

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