A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces-Reference-Cited by-同舟云学术

A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces

Published:2004-02 Issue:2 Volume:33 Page:106-113
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Li Haiying,Moon Kyoung-Sik,Wong C. P.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0278-4.pdf

Reference8 articles.

1. K. Gilleo, in Conductive Adhesives for Electronics Packaging, ed. J. Liu (Isle of Man, British Isles: Electrochemical Publications, 1999), p. 3.

2. J.E. Morris, in Conductive Adhesives for Electronics Packaging, ed. J. Liu (Isle of Man, British Isles: Electrochemical Publications, 1999), p. 74.

3. M. Zwolinski et al., IEEE Transactions on Components, Packaging, and Manufacturing Technology 19, 241 (1996).

4. D. Lu, C.P. Wong, and Q.K. Tong, IEEE Trans-CPMT-C 22, 3 (1999), pp. 228–232.

5. D. Lu, C.P. Wong, and Q.K. Tong, IEEE Trans-CPMT-C 22, 3 (1999), pp. 223–227.

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