Effect of Post-Annealing on Electrical Parameters of Joints Formed from Conductive Adhesive
Author:
Affiliation:
1. Czech Technical University in Prague,Faculty of Electrical Engineering,Department of Electrotechnology,Prague,Czech Republic
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10603446/10603455/10603665.pdf?arnumber=10603665
Reference6 articles.
1. Recent advances on Electrically Conductive Adhesives
2. A review on epoxy-based electrically conductive adhesives
3. Conductivity enhancement of silver filled polymer composites through electric field alignment
4. Evolution of Electrical Conductivity in Silver-Loaded Electrically Conductive Adhesives Composed of an Amine-Cured Epoxy-Based Binder
5. Effect of binder chemistry on the electrical conductivity of air-cured epoxy-based electrically conductive adhesives containing copper filler
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