10.5104/jiep.12.588-Reference-Cited by-同舟云学术

10.5104/jiep.12.588

Published:2009 Issue:7 Volume:12 Page:588-595
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Orii Yasumitsu,Sakuma Katsuyuki,Matsumoto Keiji,Toriyama Kazushige

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep/12/7/12_7_588/_pdf

Reference40 articles.

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2. IBM Enterprise System/9000 Type 9121 Model 320 air-cooled processor technology

3. 3) Y. Tsukada, S. Tsuchida and Y. Mashimoto: “Surface Laminar Circuit and Flip Chip Attach Packaging”, Proceeding of 7th IMC, Yokohama, pp. 252–258, 1992

4. 4) Y. Kodama, T. Matsumoto and Y. Tsukada: “Carrier Bump Build by Molten Solder Injection”, Proceedings of 9th IMC, pp. 286–290, 1996

5. 5) S. Fujiuchi and K. Toriyama: “Collective Screen Printing for Carrier Bump and SMT Pads”, IEMT Ohmiya, pp. 109–112, 1995

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