Affiliation:
1. Electronic Packaging Laboratory, University at Buffalo, The State University of New York, Buffalo, NY, USA
Abstract
The insatiable demand for miniaturization of consumer electronics has brought continuing challenges in the electronic packaging field. As a consequence, immense information processing duties, high current density and large joule heating are exerted on the package, which makes electromigration and thermomigration a serious reliability issue. In this study, high frequency pulse current electromigration degradation experiments were carried out on Sn96.5%Ag3.0%Cu0.5 (SAC305 - by weight) solder joints. During the test, frequency, current density and duty factors are used as controlling parameters. The nominal current density varied from [Formula: see text] to [Formula: see text], pulsed direct current frequency ranged from 2 MHz to 10 MHz and duty factor varied between 30% and 80% with a controlled ambient temperature at 70℃. It was observed that mean time to failure was inversely proportional to the current density and duty factor. Higher frequency leads to a shorter lifetime within the frequency range we studied. Scanning electron microscope image shows that damage develops at both current crowding corners and the skin layer of solder joints. A mean time-to-failure relationship of lead-free solder joints under pulsed current loading is proposed based on the experimental data.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science,Computational Mechanics
Cited by
8 articles.
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